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Business

Failure Analysis Testing

What is Failure Analysis Testing?

Failure analysis is the process of identifying the root causes of defects in automotive PCBs (core components), which can lead to automotive performance degradation and safety issues. By using techniques such as microscopy, X-ray analysis, and thermal analysis, failure mechanisms (e.g., solder cracks, delamination, short circuits) are identified, and design or manufacturing process issues are detected to improve product reliability.

Test Items

  • Lead-Free Soldering Test

    • Purpose : Evaluates reliability of lead-free solder joints due to environmental regulations
    • Test Items : Surface defects, Voids, Semiconductor delamination, Solder cracks, Whiskering, Joint strength

  • Connector Test

    • Purpose : Assesses stable operation of connectors under various environmental conditions
    • Test Items : Insertion/withdrawal force, Housing retention force, Terminal insertion force, Environmental durability

Key Standards

ES90000-01/02/03/04/05, MS184-01/02, ES91500-00/02/20, GMW3172, GMW3191, SES E 060-07