Failure Analysis Testing
What is Failure Analysis Testing?
Failure analysis is the process of identifying the root causes of defects in automotive PCBs (core components), which can lead to automotive performance degradation and safety issues. By using techniques such as microscopy, X-ray analysis, and thermal analysis, failure mechanisms (e.g., solder cracks, delamination, short circuits) are identified, and design or manufacturing process issues are detected to improve product reliability.
Test Items
Key Standards
ES90000-01/02/03/04/05, MS184-01/02, ES91500-00/02/20, GMW3172, GMW3191, SES E 060-07